Cadence® power integrity (PI) solutions, based on Sigrity™ technology, provide signoff-level accuracy for AC and DC power analysis of PCBs and IC packages. Each tool seamlessly interfaces with Cadence Allegro® PCB and IC packaging physical design solutions.
Sigrity PowerSI
An advanced signal integrity, power integrity, and design-stage EMI solution. Supports S-parameter model extraction and provides robust frequency domain simulation for entire IC package and PCB designs. Allegro Sigrity PowerSI Datasheet
Sigrity PowerDC
An efficient DC signoff solution for IC package and PCB designs, with electrical/thermal co-simulation to maximize accuracy. Quickly pinpoints IR drop and current hotspots. Automatically finds best remote sense locations. Allegro Sigrity PowerDC Datasheet
Sigrity OptimizePI
A highly automated board and IC package AC frequency analysis solution. Supports pre-and post-layout decap studies, identifies impedance issues, and suggests placement locations for EMI decaps. Decap implementations are optimized for performance and cost. Allegro Sigrity PowerPI Datasheet